Electronics Forum | Thu Jul 20 15:37:53 EDT 2000 | Tekguy2000
These parts are flat chip resistor arrays that have 4 end terminations on each side. It looks liek an IC but is typically in an 0805 and 1206 package type with convex terminations. .031" pitch from termination to termination and .011" spacing between
Electronics Forum | Mon Mar 26 16:58:53 EDT 2018 | solderingpro
Is there anything stopping you from replacing the flat belt solution to a continuous running steel roller chain conveyor? - From there (depending upon board temperature) you should be able to buffer your boards in a vertical buffer station if neede
Electronics Forum | Thu Jan 15 12:55:03 EST 2004 | James
Polarity in tape and reel is usually always on the bottom left side. And that is correct for the trays, they have a corner taken out where the polarity goes. Hope that helps........
Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park
Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav
Electronics Forum | Fri Jul 08 18:48:50 EDT 2005 | mdang
Hi, We are a Contract Manufacturing and have a project which has a few Xilinx BGA on top and bottom side. Does anyone run a cross this or have any suggestion on how to reflow them. Thank you, -Michael
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Tue Jul 01 13:35:49 EDT 2008 | realchunks
QFNs have pads on the bottom. LCCs have pads on the sides that are exposed on the bottom.
Electronics Forum | Sat Jun 13 00:25:59 EDT 1998 | Scott McKee
Last October I purchased a Mydata over a Phillips and Amistar. I've done things on my Mydata that is impossible on the other machines. I can build the top side and the bottom side of two boards at the same time (I print both sides at once). I can "
Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
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