Electronics Forum: dfm and dave (Page 11 of 23)

Factory Lighting - specs and measurement ?

Electronics Forum | Mon Jun 17 15:04:08 EDT 2002 | genny

I think I had my units wrong in my previous post - that blueprint job was 6 years ago and fading fast. My level of 700 would have the same units as Dave's level of 1000. This is the metric measurement of lux, vs the imperial footcandles. fc to lux

lead free platings and tin lead

Electronics Forum | Tue Aug 31 19:17:43 EDT 2004 | russ

Now see Dave, now I have some good info on why it is "bad", This must be the lead enrichment I have heard about but never got any substantiated data or explanantion. I wonder how much weaker or less reliable these are. Is there any data that you k

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan

Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref

Re: Green coating and through-hole plating

Electronics Forum | Fri Aug 14 07:27:42 EDT 1998 | Earl Moon

| | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | Xingsheng | Xingsheng: Welcome. | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | Web resources: http://www.pw

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F

Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:

Re: Farewell and thanks to all

Electronics Forum | Thu Sep 09 08:43:38 EDT 1999 | Dave F

| Last Thursday I resigned from my position as manager of SMTnet. I want to personally thank all SMTnet viewers, editors, customers, colleagues, and others for your support to me in the creation and expansion of SMTnet over the last four years. I e

Re: SMT and TH board carrier

Electronics Forum | Wed Sep 01 13:58:10 EDT 1999 | Dave F

| Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective w

Re: Discoloring of Soldermask and silkscreen

Electronics Forum | Mon Apr 19 20:49:13 EDT 1999 | Dave F

| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F

| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |

Re: Green coating and through-hole plating

Electronics Forum | Thu Aug 13 12:55:46 EDT 1998 | Dave F

| Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | Xingsheng Xingsheng: Welcome. Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill Web resources: http://www.pwbrc.org/ a


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