Cad-Tech is a leading provider of solutions for the evolving electronics industry providing Assembly and Rework Stencils, Patented Static Dissipative Templates, Photoplots and excellent customer support.
Vacuum handling equipment includes, Wafer Handling Tools, Continuous Vacuum Systems, Vacuum Cups, Vacuum Probes, Pen-Vac and Roto-Pic units. Static Dissipative and Clean Room safe.
The unique electrical, thermal and mechanical properties of aluminum combined with Polyonics proven coating, adhesive and manufacturing technologies provide high quality tape material ideal for high temperature applications. In particular, Polyonics
Static Dissipative long sleeved Cardigan Comfortable and Breathable Unisex: XS-5XL With ESD symbol on the breast With short zipper or with long zipper With two side pocket ESD cuffs Colours: Navy Blue
Static Dissipative Coverall with Hood Unisex: XS-5XL With ESD symbol on the breast With conductive cuffs With Zipper Colour: More than 18 colours
New Equipment | ESD Control Supplies
ESD bags which protect ESD sensitive items. The ESD shielding limits energy penetration from electrostatic charges and discharge. They offer good see-through clarity. Available with and without dissipative zipper.
Datum Alloys is an international supplier of speciality metals and special purpose alloys,
Technical Library | 1999-05-06 11:18:25.0
The trend toward surface-mount assembly processes is making ball-grid array (BGA) packaging a popular choice for many types of devices, forcing designers to re-examine cooling of these large packages. While devices in BGAs transfer more heat to the board than leaded devices, the style of BGA packages has a large influence on the ability to transfer heat through other pathways, such as a top-mounted heat sink. Physical characteristics of the BGA further constrain the thermal designer. It takes forethought in board design to successfully accommodate devices that require significant heat dissipation. Multiple solutions exist, however, for BGA packages of all types.
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
Technical Library | 2018-04-11 22:18:05.0
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz, 77 GHz and many other mmWave frequencies. When designing a PCB for mmWave frequency, the properties of the circuit materials need to be considered since they can be critical to the success of the application. Understanding the properties of circuit materials at these frequencies is very important.This paper will give an overview of which circuit material properties are important to mmWave frequency applications using PCBs. There will be data supplied which demonstrates why these properties are essential to the circuit material selection for mmWave applications. Some properties discussed will be dielectric constant (Dk) control, dissipation factor, moisture absorption, thickness control and TCDk (Temperature Coefficient of Dk). Measured comparisons will be shown for insertion loss and Dk versus frequency for different types of circuit materials up to 110 GHz. As part of the test data, the impact on circuit performance due to TCDk and moisture absorption will be shown at mmWave frequencies.
