Full Site - : johnw (Page 11 of 20)

Re: Solder on GF

Electronics Forum | Tue Jul 13 19:00:29 EDT 1999 | JohnW

| Hi All, | Does any one experienced the solder on gold finger after | reflow. Its about 5 to 8 mils diameter . | We'd clean the entire screen printer, mounter & reflow as well, | but doesn't help much. | | Mr Kong..... Solder on gold is a age old

Re: Solder on GF

Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh

| | Hi All, | | Does any one experienced the solder on gold finger after | | reflow. Its about 5 to 8 mils diameter . | | We'd clean the entire screen printer, mounter & reflow as well, | | but doesn't help much. | | | | | Mr Kong..... | | Solder

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW

| | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | Leaching. Dissolution of a metal coating into liqu

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F

| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating

Re: Off Pad Printing

Electronics Forum | Mon Jun 28 21:07:00 EDT 1999 | Deon Nungaray

| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo

Re: vibration during solder reflow

Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup

| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process

Re: Intrusive reflow..from the bottom..????

Electronics Forum | Fri May 21 15:29:26 EDT 1999 | JohnW

Joe.. Sound's pretty neat trick..mind if I ask what type of comp's are on this board and the paste..? This baby (pig I think) has got a 244pin QFP right dam in the middle..!, so if ur flipin it 180 degree's are u using like a piece of Jot in line co

Machine Utililaztion

Electronics Forum | Tue May 28 13:34:57 EDT 2002 | johnw

There is alway's squabbles when people talk about utilization and then there's the fabled effective utilization, which rumour has it is differnt. Most of the time as you say the benchmark's aren't really there and as Mark point's out it depend's on w

No Clean Selective Solder

Electronics Forum | Thu Aug 01 13:10:46 EDT 2002 | johnw

Chris, I don't know what machine your using, but we're also playing with one at the moment and don't see any problems with micro solderballing as far as I'm aware (I'll double check tomorrow thou!) We're using Kester 977 with it and don't have a pro


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