Electronics Forum | Fri Dec 17 08:29:18 EST 1999 | Wolfgang Busko
Hi Chuck, let�s say it the other way round. We use noclean since I can�t even remember without nitrogen and all of our subcons do with no known problems. The processes are adapted to it and no complaints are heard up to now. That is related to our pr
Electronics Forum | Thu Oct 14 08:01:48 EDT 1999 | JohnW
Gee Dave That's the first time I've ever seen myself listed for a quote! Brian, what your saying is on the whole right, on the surface of it the mask, as long as it's cured properlay shouldn't make a difference but I have to say that I've found so f
Electronics Forum | Wed Sep 08 17:31:58 EDT 1999 | Earl Moon
| I am wave soldering a single sided through hole PCB array with (6) .040" round diameter pins that sit .5" off the PCB, and .080" apart. The problem being experienced is that solderballs are appearing on the end of the pins. I have tried decreasin
Electronics Forum | Thu Aug 05 10:55:09 EDT 1999 | Wolfgang Busko
| | | | | | Hello, | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but
Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall
We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau
Electronics Forum | Thu Apr 29 17:38:47 EDT 1999 | JohnW
Ok folk's has anyone used Alpha Metal's UP78 solder paste ? Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. My question's are really : how is the printability of the pas
Electronics Forum | Thu Oct 01 11:40:17 EDT 1998 | Justin Medernach
Are there anyone who can give me the answer about solder ball problem? | We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. | So
Electronics Forum | Fri Feb 20 14:33:47 EST 1998 | Dave McFadyen
Looks like (so far) we have a concensus. Follow the paste manufacturers guidelines on storage. Normally, refrigeration is required to achieve max shelf life between 3 and 6 months in original closed container. Water-wash pastes are much more active t
Electronics Forum | Wed Feb 05 13:08:20 EST 2003 | joeherz
You're correct that a thicker solder deposit will make bridging on fine pitch devices a bigger risk. Another alternative could be to slightly over-print the pads (onto the soldermask) ala pin-in-paste process. Basically adding enough solder to fill
Electronics Forum | Sat Apr 26 20:27:18 EDT 2003 | LWEI
I'm working on a protobuild for a pcba. THis pcba uses double-reflow, paste-in-hole process. On bottom side there is a Ceramic BGA, size 35 X 35 mm, thickness 6mm, over 900 balls count (ball pitch 1mm)and it weighs a hefty 20 grams. Printing uses 6 m
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