Electronics Forum: universal and instruments and 6772a and (Page 11 of 13)

Nub bying p&p, stencil printer and reflow.

Electronics Forum | Fri Apr 15 11:15:14 EDT 2011 | wrongway

Hello all lets see you are wanting to place 60,000 parts a day make sure you derate the machines you are looking at to about half of what they claim and your change over will take some time as well we do several change overs each day up to six tim

Pick and Place vs CAD File

Electronics Forum | Fri Nov 24 22:32:12 EST 2017 | myke03o

Some Customers normally don't share CAD data in order not to copy the design. What you can do is use the Pick and Place file then plot to the pcb paste/silkscreen layer of the gerber using software. Not sure if your universal machine can load a gerb

CGA devices - placement and vision

Electronics Forum | Mon Feb 26 16:26:00 EST 2001 | jax

I have not placed these parts in a while but when I did Universal was the machine that did it. We were able to place these parts using a 1mil flat( upward looking camera) inspecting all columns. The problem is a 100% column recognition is not possibl

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.

Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order

and you think youve got it hard

Electronics Forum | Thu Jul 13 00:45:15 EDT 2006 | donb

Haha, I have so many of these stories... where to start? My favourite was a few years back, we had a new mechanical engineer fresh out of university. As a part of his new role, he was purchasing tools & equipment for the maintenance workshop. After

Micro Solder Balls and Vias bridging Issue

Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007

Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Pick and Place vs CAD File

Electronics Forum | Fri Sep 29 04:43:12 EDT 2017 | spoiltforchoice

Interesting, I work much the same way as Ivan up to the sticky tape part, plodding through the BOM against the pick and place file and downloading the relevant datasheets to verify packages, this can be tedious but usually gets much quicker the more

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Fri Apr 23 15:33:50 EDT 1999 | C.K.

| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t

ultra low cost pick and place?

Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap

I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe


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