Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit
Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak
Electronics Forum | Mon May 12 10:48:49 EDT 2003 | Theresa Woodford
Does anyone have any experience with plasma cleaning? I currently have an IMS Substrate (10-15 microinch gold flash over electroless Ni) attched to Ryton PPS / R40 walls (40% glass filled/compression molded). The wall is being attached to the IMS u
Electronics Forum | Tue Jan 30 08:21:02 EST 2007 | GS
Please who can help me? I am looking for fiducial (cross shape) mark (target mark? Swiss mark?..)specifications used when COB wire bonding on PCB laminate. Pad pitch should be 250umm may be 220umm?). Mainly need to know which are the tolerances
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Mon Jun 18 19:22:38 EDT 2001 | Gil Zweig
Dave; See my answer to "Alternate to X-ray" The combination of endoscope optical inspection with x-ray inspection provides the most effective means of BGA inspection. Transmission x-ray provides a very rapid means of qualifying then process control o
Electronics Forum | Wed Sep 23 13:27:55 EDT 1998 | Dave F
All y'all, We use two methods to secure/stake jumper wires to boards: 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. 2 Loctite 382 Tak Pak We use Tak Pak "99&44/100ths" more often than the "magi
Electronics Forum | Thu Oct 26 14:41:33 EDT 2000 | Derek Vanditmars
We are planning on replacing a SMT 100Pin QFP with a COB module that will have two dies that are functionaly equivalent to the old part that will not be available. Questions: 1)Suggestions on substrate material FR-4 or something better? 2)Are there d
Electronics Forum | Wed Nov 08 14:28:39 EST 2000 | Finepitch Services
the current design must be a die-up one, so routing for a flip-chip on board will be a bit difficult. it almost HAS to be wire bonded, to me...
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