Electronics Forum | Fri Apr 23 15:04:44 EDT 1999 | M.T.
| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t
Electronics Forum | Fri Apr 23 04:02:22 EDT 1999 | Scott Davies
I need to know if there are any special component pad designs that need to be considered when evaluating paste-in-hole? We have a few through hole connectors that are good candidates to place pre reflow. Does anyone have sugguestions. Thanks Chri
Electronics Forum | Fri Apr 23 12:26:27 EDT 1999 | Jeff Anweiler
| | I would like to known what�s MESH SIZE mean in the solder paste specification ? | | | | | Check out the thread from 4/14/99 on solder FINES vs. solder balls. The info you're looking for is in there. | "Mesh Size" is a term that is commonly use
Electronics Forum | Mon Apr 26 22:53:30 EDT 1999 | Dean
| Recently, we have been having problems with PLCC's passing vision on our IP's If the part is set up to be placed on Head 2, it will not always pass vision. However, if we move it over to Head 1, it will pass and place just fine. Now, I do realiz
Electronics Forum | Wed Apr 21 17:11:05 EDT 1999 | Earl Moon
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Wed Apr 21 20:50:26 EDT 1999 | Dave F
| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo
Electronics Forum | Tue Apr 20 14:25:05 EDT 1999 | Stephen Smith
I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following crit
Electronics Forum | Mon Apr 19 17:33:17 EDT 1999 | Tuffty
25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe
Electronics Forum | Wed Apr 21 02:53:33 EDT 1999 | Raul N.
25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe
Electronics Forum | Mon Apr 19 03:53:17 EDT 1999 | Scott Davies
| | Please visit our Web site, especially 'link page', to get some hint for roll typr of cleaning wiper for automatic screen printers. http://www.squeegee.co.kr | | If the brainless idiot that keeps posting this message on the forum bothers to rea
