Electronics Forum | Mon Apr 16 11:58:07 EDT 2007 | cingsman
I believe SAC305 will result in a lesser amount of Ag3Sn inter-metallic compounds being formed along the joint boundary and in the sphere. Studies have been shown to point out a significant difference between the number and size of Ag3Sn plates in SA
Electronics Forum | Tue May 22 12:47:52 EDT 2007 | cyber_wolf
Is there anyone out there using this ? It looks like they only sell it for the 643 machines. Can it be adapted for 642 machines as well ? We have 2 major problems: 1. Operator makes width change adjust without removing supports from previous job. Ta
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Mon Nov 05 19:37:32 EST 2007 | davef
You weren't specific about the frequency band were you're operating. So, let's pound a couple of stakes in the ground. * Conventional tin-lead plating of 200-300 �m is quite satisfactory for lower frequencies in the range of 2GHz. * At frequencies h
Electronics Forum | Fri Dec 21 15:50:54 EST 2007 | rwyman
Hi smtdude- I'm no expert at PoP (yet!) as we've only done a few weeks worth of experiments for a new customer but what i can tell you is 25-50% of the ball height (not diameter) is a good rule of thumb for the flux depth, at least to start. I can s
Electronics Forum | Sat Feb 09 09:39:11 EST 2008 | stockley
You have my sympathy, the Line computer Station configuration screen is hard to get your head around. Assuming that you have configured the station correctly you might need to re-compile the station and/or consistency check it to see of it passes.
Electronics Forum | Sat Aug 30 11:42:49 EDT 2008 | davef
Some immersion silver [IAg] products can go brown with aging. On a newly plated board, we expect you to see Ag, C, & O. The amount will vary according to supplier and thickness. Questions are: * How uniform is the brown coloration of the IAg on the
Electronics Forum | Fri Sep 19 21:31:15 EDT 2008 | trynders
Thanks for the response guys! The parts are being sent to a local lab as we speak. I'll let you know the results when I get them. I am not sure the purpose of the copper band, but the black around the band is just shadowing from how I took the pi
Electronics Forum | Thu Oct 21 02:31:27 EDT 2010 | rok
OGER 4003C bounding to Aluminum I am hoping someone might have the solution to my problem I have the following PCB: RO4003 Thickness: .2mm Layer: top single/ bottom ground plane Finish: silver top and bottom .2um Size: 3mmx6mm I need to bound/groun
Electronics Forum | Thu Oct 31 17:34:37 EDT 2013 | hegemon
Keep in mind that you may need to assure that there are no pure tin finishes remaining on your parts. A general idea is that parts with pure tin (RoHs) finish will need to be plated with tin-lead solder to avoid the possibility of tin whiskers formi
