Electronics Forum | Wed Dec 06 21:28:12 EST 2006 | davef
It's worse than just using the test equipment manufacturer guidelines. Along with that, you have to deal with each of the test fixture fabricators' preferences as well. What this boils down to is a negotiation with the test engineering group as to w
Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook
Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur
Electronics Forum | Sat Oct 17 10:43:29 EDT 1998 | smd
| Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... | | We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were
Electronics Forum | Tue Sep 17 15:03:31 EDT 2002 | davef
Contact: * PCD Magazine [ http://www.pcdmag.com/mag/reprints.html ] and ask them to send you a reprint. * Jim Blankenhorn [ http://www.smtplus.com ] and ask him to send you a reprint. Or try: * �Assembly And Interconnect Reliability Of BGA Assembled
Electronics Forum | Sat Mar 14 10:16:54 EST 1998 | Clyde F
| | | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | | Hi Craig, | | I have been resear
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
Electronics Forum | Wed Jan 30 14:11:15 EST 2008 | slthomas
We dodged it for a while but it was inevitable. Here's the question. What do I REALLY need, and does anyone even agree on it? OK, that's *two* questions. The first board we're likely to do has three parts that will need special consideration. One
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Sun Aug 02 12:24:23 EDT 1998 | Bob Willis
Sorry all the parts I have processed are just like standard BGA just swing back into possition unless they are placed off the pads and touching the next pads. All my parts have had heat sinks and are the same weight as PBGA. Are your parts light. If
Electronics Forum | Sat Mar 29 01:59:09 EST 2003 | iman
Yep, only the MLF have this blowhole/pinhole issue. Other components like SOT(transistor), CAP, RES are hey-o-kie. Btw, MLF = micro lead frame (IC/LGA) package. looks like a BGA without the solder balls. has direct attachment to the PCB ENIG pads wi
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