Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
Electronics Forum | Thu Sep 22 06:54:14 EDT 2005 | Rob
Hi Gavin, Depends on what MSD class, but in general for the more sensitive parts if they've been opened & not used within the time limit it's rebake, add dessicant & seal. Our distribution side splits them down into more manageable/production size
Electronics Forum | Fri Sep 23 03:52:41 EDT 2005 | dougs
Hi, Does anyone know if it's possible to place BGA's with pitch 0.5mm and ball diameter 0.25mm on a siemens F3. the manual says that smallest pitch on BGA's is 0.56mm. Siemens won't commit a yes or no, as you'd expect, but i'd have thought it w
Electronics Forum | Sat Oct 22 14:42:28 EDT 2005 | bobpan
we had a special nozzle made and used the new quad 0402 feeder and the machine didnt miss a part.....but its probably best only to use 1 head to pick the parts because of the z being not 'perfect' between heads and thats where you would have problems
Electronics Forum | Tue Nov 01 09:24:06 EST 2005 | UIC HSP Techs
The problem you report is very uncommon. Nozzles falling out of the placement heads can only be caused by severe mis-adjustment or failed parts. The following items should be checked: 1) Nozzle position hooks (on placement heads) 2) Clutch solenoid/
Electronics Forum | Wed Dec 14 07:27:34 EST 2005 | chunks
"find yourself a good stencil manufacturer its there job really just tell them what machine you have and they should do the rest." I have to dissagree with this last statement on so many levels. There's a reason why it's called engineering. Plus,
Electronics Forum | Mon Dec 12 21:38:05 EST 2005 | davef
Effect of lead on bismuth solders * Lead from hot air leveling (HAL) coatings can diffuse through the grain boundaries of the alloy. * Lead can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. * Melting point of this eutectic all
Electronics Forum | Fri Dec 16 01:36:53 EST 2005 | tk380514
i would assume when the PCB planner and customer would specify what "surface layer type"they want but this section is always empty but i have found that out yesterday that we only use ENIG and not FLASH GOLD, which is good to know........ but it see
Electronics Forum | Tue Jan 10 11:51:16 EST 2006 | jax
I don't believe I have ever seen a non-destructive test for "Black Pad" that I could take back to a Fab house and collect monetary losses with... But if this test method actually does hold merit then collect away. I would like to know how this metho
Electronics Forum | Tue Apr 18 04:54:30 EDT 2006 | bayanbaru
We are using Siemens pick and place machine for chip placement. Our goal is to continuous production during component replenishment. In Siemens machine, the feeders that can be removed, reloaded, and placed back on the machine while the machine is ru
