Electronics Forum | Mon Jun 30 08:32:16 EDT 2008 | grics
Earlier this month our organization began researching how turn our facility into a paperless manufacturing floor. The scope ended up widening into a much larger project. During our research we found 2 software companies so far that are pretty impre
Electronics Forum | Fri Jul 11 10:32:10 EDT 2008 | JH pbf
Got to agree with CK and Patrick. A very brief career history: 1992 Engineering Apprenticeship 1994 Job as a Temp, placing components in a local electronics firm 1996 Made perminant Process Tech through experience gained 1998 A year selling solder a
Electronics Forum | Mon Jul 14 13:45:17 EDT 2008 | ck_the_flip
Patrick... Contact LENGTH as in inches, mm, or cm...not time..is decreased with a slower belt speed. The slower the speed, the less contact LENGTH with the wave per unit time ...whereas at a faster speed, your leads are contacting more solder, th
Electronics Forum | Mon Jul 14 16:11:58 EDT 2008 | ck_the_flip
Pat, Try to run a glass plate (yeah I've used these before too), keep your wave pump speed the same, and slow down your conveyor speed. You will find the actual contact between molten solder and the 0.5" grids to be LESS vs. a faster conveyor speed
Electronics Forum | Tue Jul 15 10:05:23 EDT 2008 | patrickbruneel
Ck, Just to make myself clear I am not at all questioning your observations. What am trying to make clear is that when your wave contact area changes when the PC board or glass plate traveling speed is changed, something is wrong!!! Also an 180Deg
Electronics Forum | Thu Jul 17 20:20:12 EDT 2008 | davef
Wave set-up DOE * Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering. * Contact length the greatest impact. * Control flux density, time through preheaters, top side temperature as the board reaches
Electronics Forum | Sat Jul 19 12:07:46 EDT 2008 | operator
I have alot of experience creating assembly drawings for SMT and THT products. However, we are now doing very large ,complicated box builds that have many terminal blocks, point to point and cable harnesses. It is my job to create these assembly doc
Electronics Forum | Tue Jul 29 13:01:57 EDT 2008 | grics
I know your pain all to well. We currently use bmps or jpgs and group them by station (for case assembly) We do this for inspection purposes. Sad truth is most people on the line end up becoming the "sole builder" of the product and decide they ha
Electronics Forum | Fri Sep 05 19:56:56 EDT 2008 | hegemon
We did extensive side by side (by side) testing of three AOI machines Omron, YesTech and Mirtec. In the end, even with weighted scores, the difference in the top two machine was still only four/tenths of a point. Third place was a distant 14 points
Electronics Forum | Mon Sep 01 04:55:20 EDT 2008 | benefon
Hello all Our Omni 5 has given the 'Cooling module high temp' warning twice during the past month. I suspect that the blower motor is the culprit but have not been able to verify this because the oven has started up normally after acknowledging the
