Electronics Forum: component (Page 1077 of 1140)

Omron AOI

Electronics Forum | Fri Nov 04 01:24:53 EDT 2011 | kevintough

From what I have seen of the Omron software your most interesting challenge and prerequisite for a clean and complete inspection is a full understanding of the color triangle and it's settings. I know you can find almost the same interface/GUI in the

Who has best desktop AOI ?

Electronics Forum | Wed Nov 03 14:08:55 EDT 2010 | clampron

Good Afternoon, I would throw my vote in to Mirtec as well. I also had an opportunity quite a few years ago to compare three systems side by side. At the end of the evaluation, the Mirtec stood out over the rest. Over the past several years, I was in

Reflow oven recommendation

Electronics Forum | Fri Dec 03 16:00:48 EST 2010 | glenseely

When faced with high mass, high cost, sensitive PCBs and now with the added challenges of Pb-Free Vapor Phase is the only safe reflow method for component and joint integrity. A-Tek is the National Distributor for Asscon Vapor phase reflow. Asscon

Water Soluble Flux

Electronics Forum | Thu Dec 02 09:07:18 EST 2010 | patrickbruneel

Hi Jacki, Water soluble flux was for the majority used in the USA in the 80’s and 90’s under the motto “flux your problems away” (water soluble fluxes are very active). Water soluble fluxes have never been popular in the rest of the world. The main

Quad IV C Recommendations

Electronics Forum | Mon Jan 10 17:12:53 EST 2011 | gosswald

I have been researching older lower cost used Pick and Place machines and so far I am leaning towards the Quad IV C. There seems to be a fair amount of these units around and I have heard some pretty good things about them on some of the past posts.

SMT Parts kitting

Electronics Forum | Tue Feb 01 13:35:32 EST 2011 | rgduval

We have recently taken to setting jobs up in BOM order. So, when the job is kitted (for turn-key jobs), or verified (for consigned jobs), the job is organized in either BOM order or in the order shown on the Components in Layout report printed from

SMT vs TH

Electronics Forum | Mon Mar 07 11:54:46 EST 2011 | rway

Now I have a clearer picture of your operation. It seems your company does not want to incur the cost of board redesign, and I thought it was the initial investment of the capital equipment that had them scared. You stated, "Unfortunately I can't g

BGA failure when chamber test

Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta

Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the

BGA Corner

Electronics Forum | Wed Jun 15 13:40:49 EDT 2011 | hegemon

I have seen this before with larger PBGA components. When installed using a rework system, I would advise Convective rather thn IR. In my experience having high power (not high temp) convection is the only way to deal with these problematic devices

Adhesive Dispensing using PDP head

Electronics Forum | Wed Jun 15 22:27:40 EDT 2011 | pkamath2

Hello, My company recently installed a Positive Displacement Pump on a GSM Pick @ Place machine for dispensing chipbonder (loctite 3621) dots before mounting chip components. The head uses Universal stand nozzles (single port-small dot, dual port 0


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