Electronics Forum | Wed Jul 12 14:29:10 EDT 2006 | russ
i agree and I think we all do that the BGA is more robust in processing, BUT we forget that it is 3 dollars more per assy!!!!!!! It would take a very poor process to warrant 3 dollars per assy. If you can't place a QFP to this level (takes 3 dolla
Electronics Forum | Tue Jul 18 19:09:12 EDT 2006 | SWAG
Our lines have operators on all shifts capable of doing programming start-to-finish and can deal with almost any program related problem. We are high mix, low volume. Our builds are sometimes one of a kind with qauntities of 20 or 30. We empower a
Electronics Forum | Thu Aug 10 10:00:40 EDT 2006 | slthomas
Temp. and humidity levels are dependant upon your chemical (paste and adhesive) specifications. Ballpark I'd say 70�F and 40%-45% RH are good targets, as our paste spec. says optimal ranges are 70-77� and 30-70 RH. As far as air quality, if you bui
Electronics Forum | Wed Sep 06 17:13:17 EDT 2006 | Board House
PB-free Hasl was not mentioned due to the following: 1)Equipment Convertion at the PCB Manufacturing side is expensive. 2)You are subjecting the PCB to Higher Temps than Std. solder. 3)Most PCB Houses are not going to invest in Two Hot Air level
Electronics Forum | Tue Sep 12 15:02:39 EDT 2006 | Fred
We are being pushed to use seaborne shipping containers as the method to receive PCB�s from fab houses in China. Time on the ocean will be several days to a few weeks depending on how slow the boat is. Does anyone have any suggestions on packaging
Electronics Forum | Wed Oct 04 17:15:23 EDT 2006 | russ
that question I think I will punt it on over to some of the experts here. I really do not the "why". voids for me have always been related to the escape (lack of) of the "stuff" that is in the paste. I have seen diff pastes perform differently rel
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Mon Nov 20 11:58:16 EST 2006 | Rob
We try and do it all (Vac pack, dessicant, indicator card, MSL level, PBT, end termination material etc.) however it throws a spanner in the works if you pull a manufacturer's sealed pack from stock and the vacuum has gone where an edge of a tray has
Electronics Forum | Wed Dec 06 23:54:24 EST 2006 | valuems
Think you will find every mpm is operating on dos base software, just in the last 2 years have they got software with windows base. The mouse is related to the version of software, and the old software requires only one model of mouse. Give up tryi
Electronics Forum | Mon Dec 11 06:29:04 EST 2006 | bwet
See before cversus after pics on BGA pad repair here: http://solder.net/services/services_pad-repair.asp The "how to" instructions for traces (and pads) is here: http://solder.net/solderingtips/PadandTrace_Repair_Solder_Tip12.wmv The skill level
