Electronics Forum: what (Page 1092 of 1843)

Re: flow thru

Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.

Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de

Re: Gold finger touch-up paint

Electronics Forum | Tue Oct 26 14:26:28 EDT 1999 | John Thorup

A paint might be pretty but it won't do anything but bad for your fingers. What dave is suggesting that you run a search for is actually a spot re-plating process that you can perform with little mess or fuss. But really, find out why it happened a

Looking for someone who can fix the servo board of CP 4-2

Electronics Forum | Mon Oct 25 22:27:53 EDT 1999 | SaiWong

I have two of the servo boards of the Fuji CP4-2 SMD3 version are mulfunctionaled. I don't know if it can be fixed or not. May be the moisture killed the board. A new one costs about USD 5,000 each. I wonder if anyone knows who or which company can

Re: Gold Immersion - Soft Joints

Electronics Forum | Tue Oct 26 08:17:54 EDT 1999 | William

Dave, Last question(s). What do I do about a gold porosity problem? Dave: How would I approach the board house to check for this? They use a very well known chemistry, but is that where the pblm lies? Or would it be in their process, cycle times

Re: AQL values....how low can you go ?

Electronics Forum | Mon Oct 25 15:45:11 EDT 1999 | Dave F

Joe: Lemme see, you�re talking about controlling your manufacturing process within 4.6 defects per 100 opportunities or a 4,600 dpmo rate, a cumulative 99.95 acceptance rate, or a �2 sigma process, right? So, it�s fairly basic stuff, eh? First, yo

Re: re-balled BGAs

Electronics Forum | Fri Oct 22 07:24:11 EDT 1999 | Chris May

We are not into BGA Tech (yet !), but I was discussing other issues with a knowledgable individual, who said that they do not reball BGA's. What they do, is to have a piece of glass, apply some flux to the glass and then drag the BGA across the glas

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Electronics Forum | Thu Oct 21 10:21:54 EDT 1999 | Brian

Cliff A half-question/half suggestion. In the thread about whether gloves are necessary on the SMT forum, I replied but, because I considered that the subject is much more far-reaching than the original poster thought, I ticked other forums, as well

Re: Flux evaporation....???

Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup

Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and

ENTEK CU56

Electronics Forum | Wed Oct 20 16:55:26 EDT 1999 | NickMata

Hello all, I am trying to get some information on ENTEK CU56. I am planning to use 310M flux on ENTEK 56 cards. It will not be a double reflow (top/bottom) followed by wave. I plan to reflow, glue/cure then wave. I am concerned about burning off the

Re: Automated Labeling for SMT Assembly

Electronics Forum | Fri Oct 29 10:39:48 EDT 1999 | JohnJ

Bill, Thanks for the input. I took a brief look at the Brady machine on their website. I think their latest is the PAM 6000. It didn't appear it could keep up. My most difficult application is to put 42 labels on a 21-up board in under 1 min 20 sec.


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