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MPM UP2000 HiE Screen Printer

MPM UP2000 HiE Screen Printer

New Equipment | Solder Paste Stencils

MPM UP2000 HiE Screen Printer Substrate treatment                                                       Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

JUKI High -Speed Compact Modular Mounter RX-7R

JUKI High -Speed Compact Modular Mounter RX-7R

New Equipment | Assembly Services

Specification Model Item High -Speed Compact Modular Mounter RX-7R (P16SxP16S head) (P16Sxp8 head) (P8xP8 head) Board size Single lane conveyer

KingFei SMT Tech

SPEA 4020M Flying Probe

SPEA 4020M Flying Probe

Used SMT Equipment | In-Circuit Testers

Notes:  This system has been kept in a clean room lab.  Usage is extremely low, as it was for demo purposes only. Details:                               *        4020 M; High Speed; Manual Loading; 4 Probes; *         Internal Graphic printer; 24

Lewis & Clark

Assembleon MG-8 Pick & Place

Assembleon MG-8 Pick & Place

Used SMT Equipment | Pick and Place/Feeders

Details: • Software Version 2.13, 2.50STD R.1000 • Front FES – 24/24 • Rear fixed feeder bars – 24/24 • 2 sets carts • 3 head FNC nozzles • Gripper nozzles • 2 cameras • Hours 17,016 • High working height (max. component height 21.5mm) • Ma

Lewis & Clark

Samsung SM321S   CX-1036-J1

Samsung SM321S CX-1036-J1

Used SMT Equipment | Pick and Place/Feeders

SM321S 1608CHIP: 21K CPH(IPC) 1005CHIP: 20K CPH(IPC) SOP16: 15K CPH(IPC)/feeder QFP100: 5.5K CPH(IPC)/pallet The placement accuracy of Samsung SM321: CHIP: ±50µm (0402@3σ) QFP: ±30µm (QFP168@3σ) The PCB b

Qinyi Electronics Co.,Ltd


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