Electronics Forum: 3 oz (Page 2 of 5)

Re: Metal based PCB reflow.

Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon

| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess

Re: Metal based PCB reflow.

Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan

| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g

defects in pcb manufacturing

Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef

Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated

Flex embedded into FR4

Electronics Forum | Thu May 29 14:27:04 EDT 2003 | larryk

This flex is .001" Kapton polyimide. The flex portion of this rigid flex consists of 3 layers of 1 oz copper with 5 layers of Kapton. Part of the flex is sandwiched in standard FR4 with two layer of copper on each side for a finished thickness of .

Re: bowtwist

Electronics Forum | Wed Jul 21 13:12:11 EDT 1999 | John Thorup

| I have pcb's in which i am experiencing warping. | the boards are 12.8125" on a diagonal measurement. | they are out approximatley .010". | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the pr

Copper Finishes versus Layer Thickness

Electronics Forum | Thu Jan 04 08:33:08 EST 2007 | davef

You cannot determine foil thickness from its weight per area, because of the significant variation in the density of electrodeposited [ED] copper. But people don't care. They do it regardless. (oz/ft2)||(mils)||(mm) 1/2||0.7||17.8 1||1.4||35.6 2||2

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 00:18:05 EDT 2019 | SMTA-Vikram

3% NDF. We using 8oz 90 degree blade type razor probes, still same issue. Is there stencil we can use or selective pasting test via so flux will not build in testvia. any help or guidance will be appreciate.

White Solder Mask - color not consistent

Electronics Forum | Wed Feb 26 04:28:39 EST 2014 | chongns

Hi All member I have a problem on the stable down the color of the white solder mask PCB. first, i tough the color differences was cause by the solder mask ink, but after a close look, the color change are cause by the copper under the solder mask

Re: Metal based PCB reflow.

Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon

| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?

Re: bowtwist

Electronics Forum | Wed Jul 21 20:52:52 EDT 1999 | Scott

| | I have pcb's in which i am experiencing warping. | | the boards are 12.8125" on a diagonal measurement. | | they are out approximatley .010". | | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what i


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