ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-tack
) the ACF is applied to the bond surface. The integrated control system monitors and regulates the temperature, process time and force applied for the pre-tacking process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating?con=t
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material and applying a certain amount of temperature and force, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating?con=t&page=1
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material and applying a certain amount of temperature and force, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating?con=t&page=2
. The ACF is now positioned over the bond surface, by placing the thermode (hot bar) on the ACF material and applying a certain amount of temperature and force, the material is transferred to the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-seal-bonding-systems
Heat Seal Bonding Systems DIMA Products Corporate | Global Directory | Languages Division Only All of Nordson Heat Seal Bonding Systems Heat Seal Bonding / ACF Final Bonding Once the ACF Laminating process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems
) Process Equipment via Desktop and Stand-Alone systems up to fully automated In-Line solutions and as such the solution for all your Reflow Soldering, Heat Staking, ACF Laminating and Heat Seal Bonding applications
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/appliance
Home-Office equipment, like desktop computers, printers, paper shredders, etc.. Processes Hot Bar Reflow Soldering Heat Seal Bonding ACF Laminating Heat Steaking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/defense
. Typical applications are: Aircraft construction Automotive construction Defense weaponry Electronic systems and components. Processes Hot Bar Reflow Soldering Heat Seal Bonding ACF Laminating Heat Steaking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/electronics-assembly-and-packaging
. Typical Electronic applications LED’s LCD’s Flexible circuits Flexible displays Mobile devices Touch screens Camera attachments Sensors Processes Hot Bar Reflow Soldering Heat Seal Bonding ACF Laminating Heat Steaking Products Content Sort Order
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/aerospace
Processes Hot Bar Reflow Soldering Heat Seal Bonding ACF Laminating Heat Steaking Products Content Sort Order: Featured Name A-Z Name Z-A C-Quence - Automated in-line solution system With C-Quence™
