Industry News: amkor (Page 2 of 8)

3D/SiP Advanced Packaging Symposium Registration Open

Industry News | 2008-02-22 16:25:50.0

The SMTA is pleased to announce its spring packaging symposium. The 3D/SiP Advanced Packaging Symposium will be held April 28-30 at the Washington Duke Inn & Golf Club in Research Triangle Park, NC.

Surface Mount Technology Association (SMTA)

Three Important Symposia Featured at SMTA International

Industry News | 2009-07-30 21:44:14.0

Minneapolis, MN - The SMTA is pleased to announce three symposia to be featured at SMTA International: the Evolving Technologies Summit, Contract Manufacturing Symposium, and Lead-Free Soldering Technology Symposium.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA INTERNATIONAL 2009 BEST PAPERS ANNOUNCED

Industry News | 2009-12-17 18:14:47.0

MINNEAPOLIS, MN - The SMTA is pleased to announce the Best Papers from SMTA International 2009. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Peter Ramm, Fraunhofer EMFT, to Give Opening Presentation at International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2010-09-02 11:07:09.0

The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA Announces Lead-Free Soldering Technology Symposium Schedule at SMTA International

Industry News | 2011-07-23 00:11:26.0

The SMTA announced that the renamed Lead-Free Soldering Technology Symposium will be held on October 20, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. The scope of this year's symposium is the reliability of interconnections, particularly those studied in the second phase of the NASA-DoD Pb-Free Consortium project.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Industry News | 2017-07-19 15:29:48.0

The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2017-08-29 15:41:30.0

The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

IPC Honors 66 Members at IPC SMEMA Council�s APEX� 2003

Industry News | 2003-04-17 11:35:44.0

Honored for their contributions to IPC and the electronics industry

Association Connecting Electronics Industries (IPC)


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