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Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging

Technical Library | 2022-10-31 17:09:04.0

The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.

CALCE Center for Advanced Life Cycle Engineering

MACH-Vision(tm)

MACH-Vision(tm)

New Equipment |  

The Reliable Controls MACH-Vision is an LCD based user controller that gives operators yet another simple, flexible, and economical solution to access, control and monitor their building environments. It is a fully programmable, 5 input by 4 output,

Reliable Controls Corporation

MACH-Vision(tm)

New Equipment |  

The Reliable Controls MACH-Vision is an LCD based user controller that gives operators yet another simple, flexible, and economical solution to access, control and monitor their building environments. It is a fully programmable, 5 input by 4 output,

Reliable Controls Corporation

TAP Checker

TAP Checker

New Equipment | Software

The innovative tool suite enables the automatic generation of simulation vectors and test patterns for chip-level validation and verification of IEEE 1149.1 and IEEE 1149.6 compliant implementation. TAP Checker is based on modular platform architect

GOEPEL Electronic

used equipment, good quality with competitive price, Agilent 86100A Infiniium DCA Wide-Bandwidth Oscilloscope

used equipment, good quality with competitive price, Agilent 86100A Infiniium DCA Wide-Bandwidth Oscilloscope

New Equipment | Test Equipment

Description The Agilent 86100A Infiniium DCA is a wide-bandwidth oscilloscope that also functions as a digital communications analyzer and a time-domain reflectometer. The 86100A provides comprehensive measurement capabilities and supports wide-ba

Shenzhen jiahuijie technology Co,;Ltd

Anritsu MT8820C

Anritsu MT8820C

Used SMT Equipment | In-Circuit Testers

The MT8820C is an all-in-one Radio Communication Analyzer that is the ideal solution to test LTE, 3G and 2G wireless devices. The MT8820C supports all test functions including signaling, TX parametric, and RX parametric tests. Leveraging the strength

Test Equipment Connection

LeCroy SBAE-20

LeCroy SBAE-20

Used SMT Equipment | General Purpose Test & Measurement

Catalyst SBAE20 Standalone Bus Analyzer/Exerciser Unit The SBAE20 is a standalone bus Analyzer/Exerciser unit for use with USB 2.0 systems. It is designed for the complex testing and verification required for USB hardware and software system valida

Test Equipment Connection

Agilent 86100A Infiniium DCA Wide-Bandwidth Oscilloscope

Agilent 86100A Infiniium DCA Wide-Bandwidth Oscilloscope

Used SMT Equipment | General Purpose Test & Measurement

Key Features & Specifications Digital Communications Analyzer modes: Oscilloscope with bandwidth in excess of 50 GHz, ensuring the most accurate waveform measurements Eye diagram analyser for transmitter compliance testing Time domain reflect

Shenzhen Zhongce Photoelectric Technology Co., LTD

Agilent 86100C Infiniium DCA-J Wideband Oscilloscope Mainframe

Agilent 86100C Infiniium DCA-J Wideband Oscilloscope Mainframe

Used SMT Equipment | General Purpose Test & Measurement

40 Gb/s Jitter and interference analyzer, measuring subcomponent jitter Time domain reflectometry/transmission (TDR/TDT) for high precision impedance analysis including S-parameters Key features User configurable: mainframe with slots for two

Shenzhen Zhongce Photoelectric Technology Co., LTD

Agilent Technologies Presents Web Seminar Advanced Validation and Testing of

Industry News | 2008-05-03 17:15:32.0

PCI Express brought about a whole new series of challenges for designers and the next generation. PCI Express 2.0 takes the challenges to a new level. Doubling the speed of the link to 5 GT/s, while maintaining backwards compatibility with PCI Express 1.0 potentially opens up interoperability issues. This presentation describes the methods and tools required to validate PCI Express 2.0 designs.

Agilent Technologies, Inc.


backward compatibility searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

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Selective soldering solutions with Jade soldering machine

Benchtop Fluid Dispenser
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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.