Electronics Forum: bga and popping (Page 2 of 40)

I want to learn about bga technology from a pick and place mache

Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag

Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.

I want to learn about bga technology from a pick and place mache

Electronics Forum | Fri Jul 23 03:11:50 EDT 2010 | cobar

http://www.shanelo.co.za/SMD%20Assist.htm

I want to learn about bga technology from a pick and place mache

Electronics Forum | Fri Mar 18 14:15:35 EDT 2011 | floydf

I found it over here: http://cache.freescale.com/files/archives/doc/app_note/AN1231.pdf?fsrch=1&sr=2

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

Flexi boards and uBGA

Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG

We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w

Dye and Pry on PoPs?

Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs

In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce

Skewed and popped components

Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie

We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.

Skewed and popped components

Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW

If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a

C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.

Skewed and popped components

Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt

Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.


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