Electronics Forum | Tue Apr 01 19:36:02 EST 2003 | iman
from my humble experience : 1) check if there is nickle contaminate in the gold bath? shd have report data from the PCB fab house. 2) check if your production did 48hr bake at 125degC, IF the BGA did not come in its "original" MSD cozy packaging.
Electronics Forum | Wed Apr 02 09:25:32 EST 2003 | davef
RDR The most common cause of dewetting is from a fabricator using any form of abrasive (e.g. pumice, abrasive brushes etc.) on copper. With this process, abrasive particles get implanted into the copper (often actually swaging copper over some of th
Electronics Forum | Tue Apr 01 09:58:52 EST 2003 | davef
You're entirely correct. The gold is most likely gone away. [Don't forget you can check if the surface is still solderable with a hand soldering iron.] We're not sure it it will give you the results you seek, but consider using a dye penetrant fai
Electronics Forum | Mon Aug 25 08:44:10 EDT 2008 | rameshr
Dear Andrezj, i had attached the photos for ur reference Kindly advice.
Electronics Forum | Wed Aug 19 16:28:03 EDT 2015 | mdeley
Looking for a Santa Clara area contract service with capability to attach 15mil dia. solder coated Cu balls, ideally on a 12" x 18" PI panel, small job to start. T&R services are a plus. My initial search is coming up with device/component level r
Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching
Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef
Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla
Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
