Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
Industry News | 2008-03-25 23:59:52.0
Comment from Tetsuro Nishimura, North American Sales Manager
Industry News | 2012-09-25 16:25:15.0
Stevenage Circuits Ltd. offers Semblant Plasma Finish to address growing OEM demand for PCB surface finish advancements
Electronics Forum | Thu Sep 03 14:21:29 EDT 2009 | davef
Creeping corrosion occurs on bare metal. Most commonly, it is seen on boards with thin protective coatings [eg, bare copper, immersion silver, organic solderability preservative]. Look here: * enthone.com/docs/AlphaSTARCreeping.pdf * circuitree.com
Electronics Forum | Fri Aug 20 12:18:11 EDT 1999 | Earl Moon
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
Electronics Forum | Fri Aug 20 12:54:11 EDT 1999 | Carol Zhang
| | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | Can any one tell me what I have to change in my SMT | | process (paste, reflow, etc) If any? | | I ran one
Electronics Forum | Fri Aug 20 14:22:02 EDT 1999 | Earl Moon
| | | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | | Can any one tell me what I have to change in my SMT | | | process (paste, reflow, etc) If any? | | | I
Electronics Forum | Thu Oct 18 18:39:15 EDT 2001 | davef
Responding to your questions ... RELIABILITY OF 1% SILVER SOLDER PASTE: It�s as good as the next solder paste, all other things the same. Look at your back articles by Jennie Hang in SMT magazine. I want to say she wrote an article on the topic i
