Electronics Forum: laminates (Page 2 of 48)

T sub G

Electronics Forum | Tue Aug 25 16:28:11 EDT 1998 | Al Knudson

Hello, Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal expan

RoHS Board Delamination

Electronics Forum | Fri Nov 17 07:58:06 EST 2006 | markb

SWAG - I also forgot to mention a few things. Our delmaination was always between the large copper plane and the laminate. It is a multi-layered board, so even when the delamination appeared around components (through visual inspection), cross-sect

PCB laminate dielectric absorption

Electronics Forum | Wed Dec 13 13:42:57 EST 2000 | Mike Ihm

The dielectic absorption characteristic of printed circuit board materials is usually not listed on the manufacturers spec. sheets. Can anyone point me in a direction to help determine which laminate materials might exhibit better dielectric absorpt

Re: Non-halogenated PCB

Electronics Forum | Wed Jul 19 20:30:38 EDT 2000 | Dave F

Lennart: I think most laminators offer a halide free laminate. Two are Isola and Mica-Micanite. Contact the IPC Halogen-Free Materials Task Group

Laminate base material

Electronics Forum | Sun Mar 26 19:54:47 EST 2000 | Marc

when would one use a difunctional base laminate material as a possed to a tetrafunctional base material? What possible problems are associated with each?

Boards delaminated after wash

Electronics Forum | Tue Aug 14 15:45:06 EDT 2001 | davef

BOARD BAKING SCHEDULE: Bake time depends on the board thickness and construction. For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. ROOT CAUSE OF THE PROBLEM: Heating moisture entrapped between the laminations of the board too quickl

force between the pad and laminate material

Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao

I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame

Micro BGA pads, adhesion to laminate

Electronics Forum | Wed Jul 09 16:12:01 EDT 2003 | Matt Kehoe

Right-o Dave, Thats the 2 lifted pads turned upside down so actually you are looking at the bottom of the base copper where it used to be attached to the laminate. mk

PCB Material

Electronics Forum | Wed Dec 22 11:12:33 EST 2004 | Steve

Does anyone have an opinion about the pro's and con's of Getek vs Isola FR408 laminate? What laminate to most of you call out? Thanks in advance for your feedback. Steve

The story so far!

Electronics Forum | Thu Dec 07 20:55:08 EST 2006 | Cmiller

Implemented 6 months ago and have noticed no difference in frequency of farting. Sorry, could not resist. Have seen delamination problem with IS-410 laminate. What laminate is everyone else using?


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