Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton
We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac
Electronics Forum | Sat Apr 10 10:01:43 EDT 1999 | Jeff Price
| | I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling | | | | thank you | | | -I have had wonderful results with
Electronics Forum | Wed Feb 22 08:02:56 EST 2006 | dj44
I was looking for an stencil design for a 0.5mm pitch uBGA. Pad size is 0.38mm in diameter. We have been using 5mil stencil with type 3 no clean paste. What size aperture should we be using? Any suggestions?
Electronics Forum | Mon Apr 14 17:41:21 EDT 2008 | janz
Hello, That is working for us. If you have a look at the Indium or Cookson recommendation they are very similar. Just make few diffrent patterns of the BGA and find out what is workin for you. Regards Jan
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Fri Feb 09 06:08:36 EST 2007 | mzaboogie
Thank you so much for your input. Greatly Appreciated. Thanks Chris
Electronics Forum | Fri Apr 11 05:51:20 EDT 2008 | janz
w/4t=0.8 Regards Jan
Electronics Forum | Wed Apr 16 02:46:55 EDT 2008 | andrzej
Thanks Jan for hints
Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej
0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
