Industry News: pad size (Page 2 of 19)

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Industry News | 2010-03-27 19:26:29.0

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

Customized Circuit Frames for PCB Repair

Industry News | 2009-10-17 09:43:47.0

Reduce PCB Repair Costs

BEST Inc.

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

BGA TEST BOARD

Industry News | 2003-06-20 18:28:55.0

Makes continuity and placement evaluation a snap.

Practical Components, Inc.

FCT Assembly Solves Bridging Issues at Reflow

Industry News | 2012-04-09 13:45:59.0

As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.

FCT ASSEMBLY, INC.

How To Design Cost-Effective PCBs

Industry News | 2018-10-18 11:19:07.0

How To Design Cost-Effective PCBs

Flason Electronic Co.,limited

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Industry News | 2021-03-02 14:45:26.0

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

Shenmao Technology Inc.

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

Industry News | 2018-10-18 08:34:52.0

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

Flason Electronic Co.,limited

SN100CL Minimum Thickness Guidelines

Industry News | 2008-09-10 09:31:07.0

Saturn Electronics Corp. Providing Criteria for the Industry

Saturn Electronics Corporation


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