Performs pick and place, component placement, adhesive dispense, and flip chip operations.
3D Printers Rapid Prototyping Equipment Semiconductor Equipment - Rework Stations - Wire Bonders - Palomars, Orthodyne, Delvotec
Industry News | 2003-06-19 09:00:08.0
Leading provider of manufacturing services applies
Industry News | 2003-05-05 09:13:55.0
Reliable Wire Bonders for High Yield Production
A division of Palomar Technologies, MicroJoin designs and manufactures systems for ACF & Heat Seal Bonding, Reflow Solding with Patented Ceramic Hot Bar Technology, Equipment for Resistance Micro-Welding & TIG Welding for High Precision Metal Joining
Industry News | 2003-04-16 10:58:03.0
Award presented for Palomar's Gold Connection
Industry Directory | Manufacturer
Microjoin specializes in offering microwelding, heat seal, hot bar and welding assembly equipment used in bonding and microjoining of miniature mechanical and electrical sub-assemblies.
Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control
Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg
Industry News | 2011-07-18 12:57:31.0
The Solar Engineering & Manufacturing Association (SEMA) announces that it held a standing room only meeting on July 14 at the Palomar Hotel in San Francisco in conjunction with the recent Intersolar NA/SEMICON West expos.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
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