Technical Library: practical (Page 2 of 7)

Stencil Cleaning - A Practical Approach To Improving Yields And Maximizing Your Throughput

Technical Library | 2021-11-10 20:07:46.0

Main Points * Technologies for the job * More than a flat piece of Stainless * Compatibility * Solubility in stencil cleaning * Influencing factors * Best Practices to reduce misprints and increase yields

KYZEN Corporation

Extending Soldering Iron Tip Life

Technical Library | 1999-05-09 13:05:12.0

This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one.

Metcal

Redundancy and High-Volume Manufacturing Methods

Technical Library | 1999-05-07 10:16:31.0

This paper will describe practical aspects of a redundancy implementation on a high-volume cache memory product. Topics covered include various aspects of redundancy from a design and product engineering perspective; and present test development methods for future product implementations.

Intel Corporation

Principles of Analog In-Circuit Testing

Technical Library | 2012-12-26 14:18:24.0

Passive components including resistors, capacitors, inductors, and circuit-protection devices compose the highest percentage of all devices that are populated on today’s PCB assemblies. However, the successful isolation and testing of these components during ICT is perhaps the most challenging and the least understood of all modern-day validation practices.

Teradyne

Via Filling Applications in Practice

Technical Library | 2020-07-15 18:49:03.0

Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias

Würth Elektronik GmbH & Co. KG

Thermal Profiling: A Practical Approach to Reflow Profiling

Technical Library | 2009-12-14 20:24:19.0

In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies.

Indium Corporation

New Era in Testing DUT over Temperature

Technical Library | 2016-05-13 11:44:16.0

The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.

Mechanical Devices

Lean Six Sigma Approach to New Product Development

Technical Library | 2017-08-02 20:18:21.0

In this rapidly moving electronics market, fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little revealed that "New-Product Development (NPD) productivity in atop performing company is five times what it is in the average company. The top performer gets five times as much new product output for the same investment." What do they know that the rest of us do not? One winning factor is the use of the Robert Cooper process. (...)This paper will present a Lean Six Sigma approach to "right sizing" the Stage Gate process to be efficient, practical, and easy to manage. Various tools of Stage Gate, along with proven best practice, will be covered. In addition, a reduced Stage Gate model will be discussed for simple, low risk projects.

MacDermid Inc.

Practical Fiber Weave Effect Modeling

Technical Library | 2011-03-16 20:05:15.0

Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi

Lamsim Enterprises Inc.

Maximizing Production Productivity of Automatic Termination Machines

Technical Library | 2007-11-08 18:49:44.0

ways to increase machine utilization and productivity for automatic termination machines. This article will discuss just a few of the basic concepts. For some, this may seem academic, but going over the basics is a good reminder so we don’t overlook best practices. So, how do we get more products out the door every day?

Schleuniger, Inc.


practical searches for Companies, Equipment, Machines, Suppliers & Information

Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Benchtop Fluid Dispenser
2024 Eptac IPC Certification Training Schedule

Component Placement 101 Training Course
PCB Handling Machine with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Global manufacturing solutions provider

World's Best Reflow Oven Customizable for Unique Applications