Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie
Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane
Electronics Forum | Thu Feb 04 09:22:56 EST 1999 | Terry Burnette
| Hello all, | | Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? | | We've checked our solder paste amount, and we've rechecked our reflow profiles and nothin
Electronics Forum | Mon Jul 28 19:03:53 EDT 2003 | Ryan Liao
Hi mantis, Thank you for your helps. I had checked the CP7 error code index application. It also gives me the same answer. It tell me " the part pickup status is bad" and I have to "Make sure that the nozzle is not bent and that the part is being pro
Electronics Forum | Thu Feb 15 15:23:12 EST 2007 | bvdb
The IP-1 vision error is" "Processing Error" er 401F 4003 which the FIP-I Operating Manual says the cause is "The actual number of leads on the part exceeds the number of leads in the Part Data". I have checked and re-checked the part data, lead
Electronics Forum | Sun Mar 24 17:28:20 EDT 2013 | vikkaraja
Thanks for all the help you are giving me but I just can't put my finger on this annoying problem. I checked and recheck all sensors without much sucess against the I/O. Something I am not understand is these two followning conditions--- first one I
Electronics Forum | Thu Aug 05 10:40:38 EDT 1999 | John Thorup
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually publishe
Electronics Forum | Wed May 16 18:09:15 EDT 2007 | johnwnz
It always surprises me how many variations there are for profiling and controlling your ovens, and the thing is most of them are fairly valid. Here's yet another option: Your board profile needs to be specific, 2 boards can look identical but have ve
Electronics Forum | Sat Aug 07 11:33:55 EDT 1999 | JohnW
| | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually pu
Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper
| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua
