| https://www.eptac.com/solder-tips/
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”… Read Answer SolderTips
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| https://www.eptac.com/soldertip/soldertip-40-component-mounting-and-acceptability/
. To keep the component flush to the board could also be an issue. Please check 7.1.4 Hole Obstruction on page 7-12, which may be a problem when considering the solder joint and such
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-40-component-mounting-and-acceptability
. To keep the component flush to the board could also be an issue. Please check 7.1.4 Hole Obstruction on page 7-12, which may be a problem when considering the solder joint and such
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. Many engineers approach the problem by tweaking process parameters on fluxing, preheating, solder pot temperature, wave height adjustment and others, it merely be just a containment and not able to
| https://www.eptac.com/soldertip/smt-component-shifting/
. What is the likely cause of this problem and are there ways we can overcome it? Answer: Most times this is related to the components floating on the molten solder and the equipment having some vibrations, which could impact the locational position of those components
