| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. A real good example of this is Flexible Circuit Boards where it is best practice to solder mask define the Toe and Heel but not the side for the purpose of improving the pad adhesion to the Flex surface
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/advice-for-solder-mask-paste-mask-layers_topic484.html
. A real good example of this is Flexible Circuit Boards where it is best practice to solder mask define the Toe and Heel but not the side for the purpose of improving the pad adhesion to the Flex surface
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic484&OB=ASC.html
% area reduction in the thermal pad of a QFN package. 3. Maybe it is not directly your advice but somewhere I red about putting solder mask on these thermal via to avoid solder paste wicking. 4. The solderdam
| https://www.eptac.com/soldertips/dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip
| http://www.thebranfordgroup.com/dnn3/Auctions/PastSales/tabid/58/Default.aspx
Placement Machines (100+) Universal Gold Feeders – 8mm to 32mm Cornwall, ON Surplus Equipment to the Ongoing Operations of GE Aviation - West Jefferson [Online] SOLD - Auction Closed on 1/25/2021 World Leader in Jet Engine & Aircraft System Production
| http://www.thebranfordgroup.com/dnn3/Auctions/RecentAuctions.aspx
Placement Machines (100+) Universal Gold Feeders – 8mm to 32mm Cornwall, ON Surplus Equipment to the Ongoing Operations of GE Aviation - West Jefferson [Online] SOLD - Auction Closed on 1/25/2021 World Leader in Jet Engine & Aircraft System Production
| https://www.eptac.com/blog/3-key-benefits-of-investing-in-solder-training-and-ipc-certification
—the global association for electronics manufacturing—is considered the gold standard. The IPC has set the standard in the industry for consistency and quality to support the industry’s continued growth
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
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