Electronics Forum | Fri Dec 27 14:11:18 EST 2002 | cnotebaert
We have placed these parts. I have not had problems with them but when I designed the stencil we reduced the app for the large thermal by 20% to reduce the chance of problems like your having. If the balls are close (.040-.050" or
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
Electronics Forum | Wed Feb 19 22:08:21 EST 2003 | davef
We usually end-up emailing reports and pix to each other. Fire a copy off to me.
Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU
emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac
Electronics Forum | Mon Dec 16 10:31:21 EST 2002 | davef
Grant, On those 'dry pads', where does the solder paste end-up after soldering? On: * Pads * Component leads * Someplace else [Where?]
Electronics Forum | Mon Dec 16 21:51:28 EST 2002 | grantp
Hi, It's on the pads. They look ok, but when you check the lead comes away from the solder. Regards, Grant Blackmagic Design
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
Electronics Forum | Sat Jun 09 09:32:26 EDT 2001 | davef
Yes, your pallet will absorb / steal heat. It sounds like you are doing a good job in understanding the issues. Yes, the pallet could be the problem. Is this a new run that you are starting? Or has everything been OK, but recently you've begun to
Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
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