Electronics Forum | Tue Oct 03 11:07:00 EDT 2000 | C.K.
"In Reality there's no additional cost or extra cost for the cleaning time since there is no increase on operator's wage in doing the cleaning but instead just an additional load or job for the operators at the same wage cost." I'd have to agree...
Electronics Forum | Wed Oct 04 14:54:46 EDT 2000 | Sean
I feel Woldgang poses an interesting question. It seems you have already decided that dispensing is the path you wish to take. Yet can you tell us why? Is there a flexibility vs. throughput arguement here? Justification of dispense via the cleani
Electronics Forum | Thu Jul 27 21:34:41 EDT 2000 | Dave F
Gary: That's curious. Tell us more about your process steps, temperature profiles, paste, warping of the board without the PIH processing, components, etc
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Thu Jul 22 17:39:58 EDT 2021 | proceng1
We do use a company for custom fixtures, but we also make some in house. The biggest hurdle for a board that requires a fixture to go through printing and SMT is that the board has to be the tallest thing. So any hold downs or locating hardware has
Electronics Forum | Wed Jul 26 18:23:47 EDT 2000 | Gary
I have been following forum discussions here and eslewhere, attended technical sessions at APEX and have been experimenting with the paste-in-hole process on some of our new product. I have run into one problem I have never seen mentioned, that is a
Electronics Forum | Fri Jan 27 09:48:26 EST 2006 | patrickbruneel
GS UPS are exempt for 2 reasons: A. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications. B. The primary functi
Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Thu Mar 03 11:49:23 EST 2005 | Rob
Doesn't that depend on your company's culture & management style? We (and I feel slightly dirty using this word)empowered our end of line inspection/touch up people & trained them to know what is good or bad - so issues can be immediately fed back,
Electronics Forum | Fri Jul 15 08:20:44 EDT 2005 | stepheniii
And why do you want to control the process? To prevent defects, I would think. Actually orginally the way I first saw SPC was to reduce inspection. If you are using SPC for plating thickness, you don't have to measure every piece to be confident the
