Industry Directory | Manufacturer
Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.
New Equipment | Assembly Services
KULICKE & SOFFA 1419-3- WIRE BONDER PART MACHINE
Used SMT Equipment | Semiconductor & Solar
KNS – Kulicke & Soffa 4123 Manual Wedge Wire Bonder REFURBISHED! KNS appears to be in quite nice cosmetic condition, showing some normal signs of wear. It is being sold in working condition. Please allow two to four weeks for this
Wire-bonding Technician: Capable of programming, repair and support automatic K&S 1419 wire bonders and MECH-EL /MEI manual bonders, among with other assy equipment. Familiarity with HYBRID assemblies in a semiconductors environment. SPC knowlege.
Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual
Used SMT Equipment | Semiconductor & Solar
Becoming available soon; K&S 4124 Wire Bonding Machine currently in production to be removed in complete working condition. Contact: Assured Technical Service LLC Minneapolis, MN 55441 AssuredTechnicalServiceLLC@Gmail.com FOB Origin. The
For Wire Bonding (Wedge and Ball Bonding)
