Electronics Forum | Sat May 13 07:03:16 EDT 2000 | Sal
guys, Currently running a very high volume product, with the gold fingers at the edge of the board masked off using Kapton tape to avoid any form of contamination during reflow and wavesoldering. I've heard alot of about the gold finger gloves, my q
Electronics Forum | Mon Jun 18 10:14:30 EDT 2001 | surachai
HI ALL; I WOULD LIKE TO KNOW THAT ANYBODY CAN RUN GLUE PRINTING PROCESS WITH 0402 CHIP AND PASS THEM TO WAVE SOLDERING PROCESS ,PLEASE GIVE ME THE INFORMATION ABOUT THEM . 1)HOW WIDE OF APERTURE DO YOU OPEN ON YOUR STENCIL? 2)HOW MANY YIELD OF THIS P
Electronics Forum | Thu Aug 26 10:28:07 EDT 1999 | Stuart Adams
What are the key steps to achieving high yield with CSP ??? (We are trying qualify vendors for volume fab/assembly of some products which use several CSP devices on each side of the board. (Some with 0.5mm ball pitch)) Looking through the forum I
Electronics Forum | Fri Aug 27 13:24:19 EDT 1999 | swsng
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Sun Mar 21 06:27:45 EST 1999 | Bob Willis
| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto
Electronics Forum | Thu Jun 04 11:23:44 EDT 1998 | Frank S
If you could measure and chart 3 variables in my process, what would they be? The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure 7"
Electronics Forum | Thu Jun 04 11:57:59 EDT 1998 | Pete M
Be more specific on your problems? | If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. The
Electronics Forum | Mon Dec 22 16:09:02 EST 1997 | Justin Medernach
| I am designing an SMT pad for a ss metal switch. | Finished copper thickness is .0014 and nickle-plating | originally is 150 millionths. Initial testing yields 100,000 to 150,000 switches before intermitent failures (copper is reached.) I want 50
Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
Electronics Forum | Thu Jul 18 09:55:05 EDT 2002 | gdstanton
Mike, When we measure solder inspection yield by dividing the number of defective joints on a CCA by the total number of joints on the PWB. A defective joint is classified only once. That is we don't count multiple defects on the same joint. Our
