Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek
This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet
Electronics Forum | Mon Sep 13 11:02:08 EDT 1999 | Bill Schreiber
Mike failed to list the company that introduced the first ultrasonic stencil cleaner in 1990. The company remains the leader in stencil cleaning worldwide: Smart Sonic Corporation Tel: 1(800)906-4407 Fax: 1(818) 909-6409 e-mail: smt@smatrsonic.com w
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Thu Mar 05 13:17:19 EST 1998 | Justin Medernach
| Hello everyone! | Does any know anything about bare board size variations? | Is there a spec. or tolerance? | I'm running small lots of boards and during the screen printing process | I find that I cannot paste each board perfectly.I've tried other
Electronics Forum | Sat May 29 22:10:28 EDT 1999 | Earl Moon
| We are looking into frameless stencil systems for screen printing. Outside frame size of 29x29. | | Pros: smaller storage requirements and cheaper stencils. | | Cons: sharp metal edges, additional change over time required | | Can anyone relay
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Wed Sep 06 18:19:37 EDT 2017 | slthomas
Hi All, We are being intermittently challenged by a .5mm pitch uBGA paste release issue. We don't build with many of these so don't have a lot of history here. We've gone through 3 different stencil designs and the most consistent performer was 4 m
Electronics Forum | Thu Aug 05 11:51:44 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
