Electronics Forum: 1.1 (Page 12 of 34)

fine pitch printing

Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas

Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r

Re: smt on flexible board

Electronics Forum | Mon Dec 20 19:09:54 EST 1999 | Chris

If your flex circuit is only populated on one side, you can have the PCB vendor palletize the flex for you. What you do is have the flex circuit laminated to 062" FR4 using a thermoset adhesive like Dupont WA. Standard flex circuit adhesive. Howev

Universal Instruments Radial Inserter

Electronics Forum | Mon Aug 06 10:03:01 EDT 2007 | slthomas

I agree with jdengler on the rotary table being skewed. You need a couple of dowel pins (1 1/2" long x 1/4" dia., I think) to align that disk. Each idler is held on an eccentric cam and can be adjusted to square up the rotary table by dropping the do

BGA dead bug pick and place

Electronics Forum | Fri Jun 18 11:31:17 EDT 2004 | gregp

I think it depends on the thickness of the PORON sheet. For .3mm balls you could probably get away with a pretty thin sheet (maybe 1/16"). I don't know how thin it comes offhand. For the part you are describing I woulf try maybe a 3.5mm OD and a 1

X outs

Electronics Forum | Thu Jul 25 21:41:03 EDT 2002 | davef

1.0 X-OUT POLICY 1.1 Each Panel not to contain in excess of X% X'd-Out boards. 1.2 Each X-Out board to be marked in a manner so that Pick & Place equipment will not attempt to insert those boards X'd-Out such as fiducial reference hole for paneliz

Calculating Reflow Slope

Electronics Forum | Tue Oct 05 17:37:21 EDT 2004 | mikecollier

We currently use a KIC 2000 system to profile on our oven and create our recipes. I had a customer in today reviewing our profiles, and he had concerns that we were exceeding 4 deg. c/sec. on our profiles. The process window parameters that we use

WORK INSTRUCTIONS: Deanne's Basil Tomato Torte

Electronics Forum | Mon Jul 10 21:11:18 EDT 2000 | Dave F

Yall: Last week Mike and I got together to compare notes about our 4th of July celebrations. While similar with requisite barbecue, beer, fireworks, and Sousa; Mike won the day because of the ample selection of live music, headlined by War. Can yo

SMT component handling

Electronics Forum | Fri May 11 07:37:22 EDT 2007 | davef

IPC-A-610D 3 Handling Electronic Assemblies 3-1 3.1 EOS/ESD Prevention 3-2 3.1.1 Electrical Overstress (EOS) 3-3 3.1.2 Electrostatic Discharge (ESD) 3-4 3.1.3 Warning Labels 3-5 3.1.4 Protective Materials 3-6 3.2 EOS/ESD Safe Workstation/EPA 3-7 3.3

Heat sinking delicate leaded parts

Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner

I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei

Stencil Apertures

Electronics Forum | Sat Jul 01 04:22:09 EDT 2000 | Sal

I have two questions 1. How do I control the skewing of FETs/power regulators ? ( the one's with the big rectangular pad and two smaller one's for the leads).If I go 1:1 with the apertures I seem to get solder balling and when I tryed to minimise th


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