Industry News: bga and 3.0 (Page 12 of 28)

Discover TrueYield and 3D Inspection from Viscom at APEX

Industry News | 2015-01-20 16:51:31.0

Viscom announced today that it will exhibit in Booth #1017 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Viscom’s inspection experts will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market.

Viscom AG

Koh Young Celebrates the Laritech Grand Opening and Expansion

Industry News | 2020-01-21 09:26:05.0

Atlanta, Georgia – A Grand Opening ceremony will be held on Thursday, January 23, 2020 to celebrate the opening of a new Laritech facility in Moorpark, California. “As a long-standing Koh Young partner, we could not be prouder of their growth and trajectory,” said Allen Phung, Regional Sales Manager for Koh Young America. “At the event, visitors will be able to see why Koh Young is proud of the accomplishments reached by Laritech. We look forward to continuing this relationship and supporting their growth.”

Koh Young America, Inc.

Cooperation between GOEPEL electronic and DM&P enables new Test Strategies for x86 System-On-Chip

Industry News | 2011-03-03 11:50:19.0

GOEPEL electronic has developed special VarioTAP® IPs for testing VORTEX x86 chip series in cooperation with the Taiwanese Company DMP.

GOEPEL Electronic

ASCENTECH, LLC Exhibiting Contamination Testing and Optical Inspection Solutions at IPC/APEX 2017

Industry News | 2017-01-19 16:57:12.0

Ascentech will be exhibiting the latest innovative contamination testing, optical inspection, and other productivity-enhancing technology at IPC/APEX in San Diego. Ascentech will show the remarkable GEN3 CM22+, one of the company’s award-winning CM+ range of contaminometers. The CM+ Series measure the amount of ionic contamination in accordance with all existing test methods often referred to as ROSE testing as well as the new PICT test. The CM22+ is a freestanding system able to accommodate larger assemblies while maintaining a low surface area to test solution ratio.

Ascentech LLC

Soldering, Coating, Cleaning and PCB Process Failures from the Desk of Bob Willis

Industry News | 2018-03-25 13:21:16.0

The widest selection of online webinars in the industry has added more titles

ASKbobwillis.com

SHENMAO Offers Water-Soluble Solder Paste for SMT and IC Packaging Applications

Industry News | 2019-05-27 21:16:27.0

SHENMAO America, Inc. introduces PW215 Water Soluble Solder Paste, ideal for SMT and IC packaging applications. With a wide reflow window, this water soluble solder paste can effectively fit into the design process for even the most complex SMT or IC assembly substrate designs.

Shenmao Technology Inc.

SHENMAO SM-901 Water-Based Wave Soldering Flux Ideal for Lead-Free and Tin-Lead Wave Soldering

Industry News | 2019-05-27 21:25:14.0

SHENMAO America, Inc.’s SM-901 Water-Based Wave Soldering Flux has been designed for use in lead-free and tin-lead wave soldering applications. The company also offers the SMCW Series Water-Based Cleaner, which is ideal for removing flux residues and other smudges.

Shenmao Technology Inc.

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Industry News | 2021-03-02 14:45:26.0

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

Shenmao Technology Inc.

SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

Industry News | 2018-09-18 20:19:23.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.

Shenmao Technology Inc.

PerkinElmer Introduces Enhanced Protein Analysis and Imaging Portfolio

Industry News | 2007-10-09 00:22:12.0

SEOUL, South Korea--(BUSINESS WIRE)--Oct. 8, 2007--PerkinElmer, Inc. (NYSE: PKI), a global leader in Health Sciences and Photonics, dramatically strengthens its portfolio of protein analysis and imaging technologies with the introduction of five new products at the Human Proteome Organization's (HUPO) 6th Annual World Congress in Seoul, South Korea, Oct. 6-10.

PerkinElmer Optoelectronics


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