Electronics Forum | Thu Feb 04 10:00:26 EST 1999 | Terry Burnette
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu Feb 04 18:45:56 EST 1999 | Earl Moon
| Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). Michael, In the "real wo
Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen
Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). | | I'd like to find some t
Electronics Forum | Wed Feb 03 18:32:07 EST 1999 | Earl Moon
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu Mar 16 16:23:12 EDT 2017 | u4bga
I'm wondering what can we learn from an X-Ray analysis of solder joints - specifically, non-BGA joints (through-hole & SMT) joints.
Electronics Forum | Thu Mar 16 17:33:40 EDT 2017 | dontfeedphils
Voiding, fracturing, barrel-fill, I'm sure there are some I'm missing.
Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb
Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m
Electronics Forum | Thu Mar 23 02:10:59 EDT 2017 | alexeis
Hi, Based on our experience, you can collect X-Ray analysis of solder joints and calculate values of SPC (such as PP/PPK and GR&R). Now, you can find, based on this calculated values, if your production is good or not. Also, this helps you to detect
Electronics Forum | Tue Dec 27 13:58:20 EST 2005 | samir
I think alot of those X-Ray machines out there "over-emphasize" BGA analysis. It'll measure every aspect of the BGA, like size of voids, percent voids, how many voids, cumulative sum of the voids, shape and geometry of voids, statistical distributio
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
