Industry News | 2009-03-16 18:15:48.0
Essemtec will exhibit the PANTERA-XV SMD placement system in booth 2225 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Industry News | 2009-08-20 15:26:58.0
To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.
Industry News | 2010-04-14 20:57:38.0
From the recently re-energized Horizon platform, through to comprehensive print process control tools and next-generation stencil technologies, the DEK display at Nepcon Shanghai will treat booth visitors to the ultimate in print productivity. Being held from 20th – 22nd April at the Everbright Convention & Exhibition Centre, the twentieth Nepcon Shanghai event will see DEK demonstrate a selection of advanced products and processes from booth 1E08.
Industry News | 2010-06-11 15:24:29.0
DENVER, CO — Krayden, Inc., a leading distributor of engineered materials, announces that the popular Humiseal UV40 conformal coating is now available as a gel.
Industry News | 2011-08-30 20:10:58.0
At this year’s Productronica 2011, booth #A4-281, Finetech will present selected highlights from the acclaimed FINEPLACER® bonder range.
Industry News | 2013-03-13 13:43:59.0
Formulated to address the limitations of alternative products, Henkel Electronic Materials announces the commercial availability of two encapsulants for selective protection of environmentally-susceptible components. The materials, LOCTITE ECCOBOND UV9060F and LOCTITE ECCOBOND EN 3707F, deliver an impermeable barrier to potential environmental influences and offer manufacturers cure process flexibility and deposition traceability.
Industry News | 2014-02-27 11:48:51.0
Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
Industry News | 2014-04-02 20:56:21.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.
Industry News | 2016-02-16 20:18:38.0
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.
