YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA 6/20/2023 (Albany, NY)– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative
Industry News | 2010-03-24 14:00:36.0
ITASCA, IL - Kester announces that representative Gardner & Meredith will showcase its NXG1-HF, a lead-free no-clean solder paste, at the upcoming SMTA Atlanta Expo and Tech Forum, scheduled to take place Thursday, April 15, 2010 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2010-10-04 16:59:29.0
The Balver Zinn Group announces that Gerjan Diepstraten will present a paper titled "Clean 'No-Clean' or Use a Water Wash Solder Paste?" at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2016-03-03 10:33:15.0
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.
Industry News | 2023-04-24 19:16:05.0
SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
