Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
Electronics Forum | Sun Aug 06 16:37:00 EDT 2000 | fraser
1. A step stencil is a waste of perfectly good stainless steel! 2. They are characterised by lousy prints on the very parts that are most critical in your process - whilst leaving good prints on the easy stuff. 3. MMM.... nasty chemicals! 4. Exactly!
Electronics Forum | Thu Jul 13 04:01:02 EDT 2000 | JohnW
Dave, Firstly..how the heck are you?..been a while.... Ok so I'm running an Electrovert Electra witha hot gas knife, & I've got large server boards going over the wave. I've seen us loose chip, mainly Tants on the hot gas knife...ain't good especia
Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F
Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co
Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F
Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o
Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko
Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have
Electronics Forum | Tue Jun 13 21:07:54 EDT 2000 | Keith Luke
Cunli, Thanks for the feedback on OnBoard. We will be introducing the new OnBoard Forum component page next week. There you will be able to quickly access archived OnBoard Forums, and see our schedule of upcoming events. We are still weighing w
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Fri Apr 14 11:00:38 EDT 2000 | Dave F
Mario: Your ask a very broad question and give no background information. Generally, the amount and type of residues present on a printed circuit board at the very beginning of a SMT line depends on the exposure of the board up to that point. For
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
