Electronics Forum | Fri Dec 20 12:12:12 EST 2002 | russ
Thanks Dave, I was looking in the Murata data base and couldn't even find the part (Even though they are the ones making it)let alone the pad dims. This part looks like it could be fun anyway. Russ
Electronics Forum | Fri Dec 27 14:11:18 EST 2002 | cnotebaert
We have placed these parts. I have not had problems with them but when I designed the stencil we reduced the app for the large thermal by 20% to reduce the chance of problems like your having. If the balls are close (.040-.050" or
Electronics Forum | Mon Jan 13 11:26:58 EST 2003 | russ
Could you provide the specific alloy info (percentage od each) OR provide the melting point of this alloy? Please also provide the component specs (pitch, ball diam.) And the pad size and design used on the board. Russ
Electronics Forum | Sun Jan 26 21:09:32 EST 2003 | Grant Petty
Hi, Ok, thanks for the info, and I had not considered that factor. Is this an issue related to the reflow temperature change in the oven, or a temperature change in normal product use issue? I will check out the standard, and do you know where it's
Electronics Forum | Wed Jan 22 14:14:56 EST 2003 | Stephen
Most of the design considerations will be for the wave soldering of the SMT parts. Have you considered selective soldering pallets or masking as an alternative? One problem I have seen with the epoxy process is parts that are high off the board and t
Electronics Forum | Tue Feb 04 17:24:07 EST 2003 | jonfox
we have some pretty tight 0402 placements and our best fix was to reduce the pad (vertically speaking) from .030x.022 to .020x.022. Fewer tombstones and the paste flows out to the edge of the pads nicely. Only difference is that we have a 6mil sten
Electronics Forum | Wed Feb 05 10:23:26 EST 2003 | russ
Are these the only packages that you could come up with Dave? What about all the rest? You're something else. Thanks for doing my work for me! Russ
Electronics Forum | Wed Feb 05 14:20:45 EST 2003 | Stephen
One thing that worked for me was simply rounding off the pads, making square pads into circlesfor the stencil. It worked but did seem a little strange turning squares into circles for 0603's and 0402's and turning cirlces for BGA's into squares, (bu
Electronics Forum | Wed Feb 05 21:24:35 EST 2003 | davef
Stephen's correct. Radiased outer corners on 0402 pads really do seem to improve things. We aim to try "squared-up semicircles".
Electronics Forum | Fri Feb 28 10:02:39 EST 2003 | bradlanger
Thanks for all the input on this thread. My company bought an FKN depanalizer and that solved our problem. I am also working with our design engineers on laying out the boards without the caps near the edges.
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