Electronics Forum | Thu Dec 23 03:13:47 EST 2004 | Steve Stach
The "Rose" test is a process control tool because it is cheap and easy to use. It has it's problems; but, it is generally agreed to be the best tool available for this purpose. All others are much more expensive and time consuming to run every day.
Electronics Forum | Wed Dec 15 18:03:28 EST 2004 | russ
I have used both 4 and 5 mil stencils for 10 mil round apertures. We don't have volume measurement capability but we measure height and the 4 mil appeared to have more paste and better uniformity from a visual standpoint than the 5 mil. The unfortu
Electronics Forum | Tue Jan 11 13:27:43 EST 2005 | dorklover664
I think with any feeder your going to loose parts. After running the five most popular pick and place machines all I can say is, TAPE. Have your operators tape the reel after they remove it from the feeder. It coasts more in ESD tape and it�s a pain
Electronics Forum | Mon Jan 24 12:27:20 EST 2005 | dougt
At the risk of siding with gregp....... I like how this machine looks http://www.contactsystems.com/C5s.htm Rather than read about this machine from people who have never used it I would like to have someone who has seen it run please give an hones
Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Tue Feb 01 11:34:55 EST 2005 | Dougs
Has anyone heard of any software that can be used to clean up or manipulate x-y placement data. We are a small contract manufacturer with various customers, some who supply good x-y data to component centres and some who supply x-y data to a pin or
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Thu Jul 07 16:46:52 EDT 2005 | adrian
I am using pretty often the re-balling Winslow Automation kit for many BGA packages we have to re-ball. When I have started doing this, I've tried to use "BGA REBALLING INSTRUCTION" manual (PR-4048 REV.F), but it didn't work. For some reason, althoug
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Electronics Forum | Fri Feb 11 08:28:21 EST 2005 | jdengler
Simple answer no. Do the operators currently use set count and set sequence commands? How many mistakes do they make with just these 2 commands? Then in a few years you will find your operators have turned over again and you will have less knowl
