Electronics Forum | Thu Oct 15 17:29:29 EDT 1998 | Christopher L.
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
Electronics Forum | Thu Oct 15 21:19:21 EDT 1998 | Scott McKee
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
Electronics Forum | Thu Sep 03 13:49:30 EDT 1998 | Earl Moon
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Wed Sep 09 01:28:33 EDT 1998 | John Godfrey
| | I am in need of possible causes and solutions to capacitors that are failing in the field. | | Are there issues in our process that need to be | | checked? | | Some people said the problems are due to improper | | storage. Others say it is th
Electronics Forum | Fri Aug 14 15:47:31 EDT 1998 | Ben Salisbury
All we've bought is used equipment...and since the start I've learned alot about the inner workings of FUJI equipment. The first set of machines were bought from a re-seller, they were all functional but far from being in good shape. At the time, t
Electronics Forum | Tue Jul 14 10:26:13 EDT 1998 | Ben Salisbury
| Frank, | Call Circuit Technology Center in Haverhill, MA. The number is 978 374 5000. Ask for Andy Price. These guys specialize in rework. They perform a variety of circuit repair services from mass removal of passives up through BGA and maybe
Electronics Forum | Wed Jun 17 14:46:18 EDT 1998 | Robert Smith
1. I need to be able to probe into my product's substrate which has all components in die form. I would need to be able to bring out any pad information for hookup to a scope or any other external piece of equipment. I do not have the convenience o
Electronics Forum | Tue Jun 09 09:28:57 EDT 1998 | Earl Moon
| | If any one needs a procedure for rework and repair of BGA there is a document on my Web Site to download www.bobwillis.co.uk | | | What methods do people use to dress pads after removing and before replacing the BGA? | | | We use solder wick and
Electronics Forum | Wed Mar 11 15:16:42 EST 1998 | Robert Joosten
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Hi Craig, | I have been researching
Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
