Electronics Forum: boarded (Page 1177 of 1638)

iPulse M4e Pick and Place Machine

Electronics Forum | Fri Oct 21 08:03:40 EDT 2005 | Mike

Hello Darby, because of the machine configuration it depents very strong on the feeder configuration and on the board if the 3 heads more give you so much more CPH. Realistic it will only be 1-2000 CPH more in realistic operation. On the other hand

SMT tape boards!

Electronics Forum | Thu Oct 27 12:33:13 EDT 2005 | stepheniii

I'm all for "tools in the tool belt". More > is better. There is a diminishing return on > equipment life. This translates into diminishing > quality. > I'm all for "tools in the tool belt". More > is better. There is a diminishing return on

Matte Sn Plating

Electronics Forum | Mon Oct 24 17:56:57 EDT 2005 | Ali

Hello all: A couple of queries on matte Sn plating: My Application: 2 Reflows in subassembly reflow+ 8 Hr Steam age+ Solderability (Dip and look) for sub assembly to mother board soldering. Queries on Matte Sn: 1- Different plating vendor

V-score cracking components

Electronics Forum | Tue Oct 25 22:28:27 EDT 2005 | KEN

I have never heard of heating boards prior to v-score. Have you established any trends on component orientation and cracking? What is your v-score thickness range? Do you have your blades regularly sharpened? Have you measured your blade alignment?

Baking for delam prevention

Electronics Forum | Thu Oct 27 11:45:06 EDT 2005 | Jeffm

I have a multi layer (8) PWB with blind vias going from 1 to 7 that is experiencing occasional blistering (delam). It is only on perhaps 15% of the boards run. We vacuum baked (85C, not sure what pressure) a sample lot and still had a few exhibit the

MPM AP25, separation problems

Electronics Forum | Fri Oct 28 10:04:02 EDT 2005 | valuems

Hello Since we have a few years experience with these printers we might be able to help. Is these problems always with the same components? Is this a new type of paste for you? Is there tape on the bottom of the stencil? And how much pressure do

MPM AP25, separation problems

Electronics Forum | Mon Oct 31 03:42:47 EST 2005 | pavel_murtishev

Good day, Problem appears only with 0.5mm pitch components. Print quality for these components is unacceptable. Paste type isn�t new for us. No any tape on the bottom of the stencil. We apply enough pressure on squeegees, stencil remains clear after

MPM AP25, separation problems

Electronics Forum | Wed Nov 02 13:24:09 EST 2005 | valuems

Hello Sorry we have not answered sooner, been gone. There is a height adjustment on the wiper. You will find a round nob under it, that is a height adjustment. I expect the wiper is not going all of the way up. And you can also control the speed

Component Testing for RoHS

Electronics Forum | Fri Oct 28 11:04:43 EDT 2005 | JW

We are planning to purchase a portable XRF unit to do our LF component testing. While we were running our first proto run of LF boards for a customer, we just happen to demo a XRF unit and found lead in a "certified Lead-free component"!!! Considerin

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Wed Nov 02 21:58:17 EST 2005 | KEN

Copper wire will become thinner when dipped in tin/lead or lead free solder. The copper is disolved off of the bulk wire. This is one reason rework on solder pots must be restricted. Eventually, after repeated cycles you will have smaller and sma


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