Electronics Forum: forum (Page 1192 of 7890)

Lf BGA

Electronics Forum | Thu May 25 08:58:14 EDT 2006 | inds

aj, check out the link http://www.smtnet.com/forums/index.cfm?fuseaction=view_thread&CFapp=8&Thread_id=10387&mc=5 as Samir mentioned in that link, try keeping your peak temp within 220-225degC.. TAL 217 around 20-40 sec..depending on your ball d

SMT Assembly Line

Electronics Forum | Fri Jun 09 07:58:54 EDT 2006 | samir

Guru/Moonman, Shocker, and Wave Master (who seems to have made a comback of sorts) make this blog entertaining and inject some much needed humor on the forum. Let's face it, guys. There's a nerdy Napoleon Dynamite in all of us, and most of you gu

Stencil cleaning

Electronics Forum | Wed Jun 14 21:56:07 EDT 2006 | davef

Stencils should be cleaned frequently enough to ensure total removal of any bottom side residues, but not so infrequently as to allow the same residues to dry or cake on, making their removal much more difficult. Look here: http://www.smtnet.com//fo

Production Defets

Electronics Forum | Fri Jul 28 21:58:44 EDT 2006 | Wave Master Larry

All you funny guys and your names. Listen, this is whats wrong with this forum and the world today. Too many clowns making fun of serious buisness. What the hell is POD group anyway. Sounds like some outer space movie to me. Maybe they hung up o

Time to Setup a New Assembly Line

Electronics Forum | Fri Aug 18 23:42:33 EDT 2006 | Efren

Hi Guys, As always, you bring interesting advices. I just take an idea about the issue. I will let all of you know about my progress, and I expect to share my experiences too in this forum as a matter of retribution for the advices I already have re

Auomotive: Conf Coating

Electronics Forum | Thu Aug 31 15:56:12 EDT 2006 | GS

Many thanks Saaitk, The PCB to protect could be (fuel cut off control system against tiefs ...)located in between driver cabin and engine. I have done a quick look on HumiSeal Automotive Products, found Acrylic Resin, Model 1B66 should be a suitabl

Cracking

Electronics Forum | Thu Sep 07 11:01:52 EDT 2006 | davef

BGA cracking is caused by mechanical stress. This may be the result of: * Rough handling of soldered board * Inadequate consideration during package design of CTE effects on BGA * Poor control of or selection of thermal ramp rates during soldering

SAC lead free solder joint strength specification

Electronics Forum | Sun Sep 17 09:02:53 EDT 2006 | davef

Just as you will not find such a specification for SnPb solder, you will not find such a standard for SAC. We talked about solder strength several times previously here on SMTnet. Search the fine Archives for others comments. For instance: http://

i-PULSE placement systems

Electronics Forum | Fri Sep 22 15:00:37 EDT 2006 | Bill

Oh, please, give me a freaking break!!!!! Can't you keep politics out of this forum. Not the Brit. What they use in Turkey and Tunisia- yeah, those two technical hot beds, they know electronics like I know making a carpet. Syria- you should be next f

Look what I found - is this stencil printer a known product?

Electronics Forum | Wed Oct 25 12:58:04 EDT 2006 | russ

Bottom line is, If you have to pay a fee to buy spare parts then the company is not worth doing business with. They obviously have no intention of becoming a partner only someone to take your money at every opportunity. Lets keep this a technical f


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