Electronics Forum | Sat Jul 07 08:19:47 EDT 2001 | Stefan Witte
If your pads are raised as you mentioned, you will reach just the tip of your tiny glue dot, which may not hold the part in place. However, you should be using two glue dots on each side of your 0402 component. See under adherence force in paste a
Electronics Forum | Wed Jul 11 14:08:21 EDT 2001 | markhoch
Are you guys providing adequate board support during glue dispense and placement? I've had this same problem with 0603's that I was able to correct with adequate board support. Also, if you're using a Fuji glue machine, what are your temperature sett
Electronics Forum | Tue Jul 10 13:45:23 EDT 2001 | markhoch
We're stencil printing a Loctite 3614 Chipbonder adhesive, and we're using BioAct SC-10 presaturated wipes to clean the stencil after printing, without much luck. Operators are not able to remove all adhesive material left in the aperatures, and aft
Electronics Forum | Tue Jul 17 18:19:09 EDT 2001 | dave
CONNECTOR, 4 X 40, MALE, SM, 0.472 STANDOFF301-00030TOLC�Mount(1,27mm),.050",(0,64mm) .025",micro pitch Looking for someone who has had experience placing this Samtec style of connector .We are having issue with open solder and insufficent. We are no
Electronics Forum | Thu Jul 19 22:52:43 EDT 2001 | davef
Most paste manufacturers talk about a 12 month shelf life for paste. They give the user half of that time. The remainder is used-up in processing and distribution. We'd give it a shot. You paste supplier should be able to give you a much clearer
Electronics Forum | Sun Jul 29 21:33:30 EDT 2001 | CAL
Your Ionograph and Zero-ion Values are set by you. There is no raw pass of fail criteria only the limits you set up. Ionograph is great for bare board resistivity (salt) test just as a pass fail for incoming inspection but this is all per your facto
Electronics Forum | Mon Jul 30 09:31:46 EDT 2001 | kennyhktan
Dear All, I'm now facing with 0805's component missing problem at the production after mounting. In able to containing the defect I'm been trying to increase the soldering strength by changing the stencil thickness from 6mil to 8 mil on a step do
Electronics Forum | Fri Aug 03 12:24:14 EDT 2001 | hinerman
I can only describe how the Grid Lok handles component variability. The compliant caps have an annular ring that is very soft and can mold to different shapes. If a component shows up where there was no component before, the outside of the cap bend
Electronics Forum | Wed Aug 01 11:11:38 EDT 2001 | JohnW
hi Folk's, Ok so I'm looking for some thoughts on Conductive Epoxy's. I'm trying to replace a material that i can place between a QFP and the PCB to transfer heat from the component to the PCB. The material has to be able to be injected thro' a hole
Electronics Forum | Mon Dec 27 12:24:47 EST 1999 | RICK_EEI
Hi everyone. We use a small ultrasonic aqueous cleaner. After each PCB we hand solder, (water soluble) we place it in the cleaner immediately. Lately we have had some problems with the solder joints appearing to be corroding away. We tried lowering t
