Electronics Forum | Sat Feb 14 13:33:10 EST 1998 | ashok dhawan
| I am beginner in BGA assembly and am confused in selection of centering method on pick and place operation.. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you can use Mechanical c
Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve
We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe
Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
Electronics Forum | Wed Jun 26 08:52:03 EDT 2002 | davef
There is no industry standard for reballing BGA. Search the fine SMTnet Archives for a reference to Motorola�s reasoning behind their not shipping product with reworked BGA. As background: * JEDEC is the semiconductor engineering standardization gr
Electronics Forum | Wed Apr 30 03:44:45 EDT 2003 | chrissieneale
Lwei, Our boards are double sided and have BGA's on one side. We always run this side first so we can x-ray inspect the BGA's for short circuits, then run the second side. Depending on what industry you are in you may have some problems.. we work in
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Wed Apr 28 16:07:32 EDT 2004 | davef
In rework, your thermal recipe needs to better mimic the recipe that your use in your reflow oven. Oh, that and proper preheating of the board and BGA. [Yano, if you get bored fighting this, rereflowing the board is within reason.] That you are hi
Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS
Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of
Electronics Forum | Sun Nov 20 22:35:26 EST 2005 | pyramus
Hi guys!! Just want to ask regarding the Bluetooth Module. The module has BGA inside shield before production we checked Raw materials no short probems. But after Passing N2 Reflow during normal production the BGA inside module tend to get shorted..
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