Electronics Forum | Fri Oct 22 21:23:59 EDT 1999 | se
Tombstoning is usually oven profiling, see October 14 thread below. Aperture rules are misleading. Component mix, stencil thickness, paste factors, all contribute. Also, are you making the stencil from a paste or pad layer or from a soldermask layer?
Electronics Forum | Thu May 30 12:27:25 EDT 2013 | ericrr
I was more interested to read up on paste, As for the short run of 50 panels was finished, the panels dribbled out slowly. about three times the second day I took off the paste, mixed it up and put it back on, seems to do the trick. Also I gave ea
Electronics Forum | Wed Dec 11 14:38:25 EST 2019 | slthomas
The one thing I haven't seen mentioned yet is developing the the control systems for the process equipment and materials. You don't want to mix up your solder paste, bar, and wire, and you don't want to cross-contaminate by using equipment (solderi
Electronics Forum | Fri Nov 16 03:03:44 EST 2001 | madreindeer
John, I have seen process mixed technology in customer site.Now they dont use wave but they print paste through hole components.It is good and fast but it did take a time when they found a right paste to do that.Stencil is plastic and aprox.3mm(3000
Electronics Forum | Sat Mar 29 15:29:06 EDT 2008 | aw
I am printing a ceramic paste through a 160 mesh screen that should have a theoretical wet print thickness of 53um but the only way I can get the print that thin is to increase down stop and slow the stroke. This is causing problems with the mesh, s
Electronics Forum | Fri Feb 29 08:12:56 EST 2008 | davef
Solder paste suppliers often make recommendations on solder paste handling after removing it from the container [eg, jar, cartridge, etc]. For instance, Multicore Solder Paste Handling Guidelines, September 2004 says: As a general rule, paste that h
Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev
Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo
Electronics Forum | Tue Jul 20 19:09:25 EDT 1999 | JohnW
| | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk pas
Electronics Forum | Wed Jul 21 10:05:22 EDT 1999 | Mark Quealy
| | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk p
Electronics Forum | Mon Aug 22 09:01:09 EDT 2005 | iwan
Well guys, I just buy a brand new solder paste softener Malcom type SPS2, I've tried with this with this viscosity result. I Use Almit Solder Paste Lead Free LFM-52X 1 min : 264 pas. 2 min : 272 pas. 3 min : 277 pas. I use standard for Viscosity 20
